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Material properties and application of 4N, 5N high purity low oxygen spherical copper powder
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I. Product Introduction
PRODUCT INTRODUCTION
Copper (Cu) is a transition metal element, monomers are purplish red, density is 8.960g/cm³ (solid), melting point of 1083.4 ℃, boiling point of 2562 ℃, ductility is good, good electrical conductivity and thermal conductivity, antimagnetism, is the common material for electrical and electronic components. High purity low oxygen copper powder is a pure copper powder with extremely high purity and low impurity content, widely used in electronics, electrical, aerospace, powder metallurgy and chemical industry, etc. Its unique physical and chemical properties make it ideal for manufacturing high-performance components and materials.
Jinggao Premium Materials adopts 4N9, 5N9 low-oxygen copper as raw material, and produces it by adopting the production process of air atomization, and the finished powder has good physical properties:
1, ultra-high purity: the purity of aerosolized high-purity low oxygen copper powder usually reaches 99.99%, 99.999% or higher. The high purity makes it excellent in electrical conductivity, thermal conductivity and corrosion resistance, which meets the needs of high-precision and high-performance applications.
2, low oxygen content: in the production process, strict control of oxygen increment, powder finished oxygen content ≤ 200ppm, the minimum can be controlled below 100ppm. This feature avoids the formation of an oxide layer, enhances electrical and thermal conductivity, and improves the mechanical strength and ductility of the material.
3, high degree of sphericity: aerosolization technology produced by the copper powder particle size uniformity, spherical or nearly spherical shape, with good fluidity and filling. This fine and uniform particles can provide a larger surface area, which is conducive to the uniform distribution in the powder metallurgy and coating applications, enhance product density.
4, good fluidity: powder Hall flow rate ≤ 20s / 50g, with good fluidity.
5, particle size can be controlled: according to different application processes can be prepared -500 mesh, 15-45 μm, 45-105 μm, 53-150 μm, such as particle size of pure copper powder (can also be screened in accordance with the user's requirements of other particle size).
FIELDS OF APPLICATION
1、Electronics industry: Due to the good conductivity and high stability of pure copper powder, it can be used in the manufacture of various electronic components, such as capacitors, electrodes, electronic circuit boards, transistors, etc. In addition, it also plays an important role in the manufacture of high-precision electronic components and connectors. In addition, it also plays an important role in the manufacture of high-precision electronic components and connectors.
2, powder metallurgy: pure copper powder in powder metallurgy is also widely used in the manufacture of mechanical parts, such as gears, bearings and pump bodies.
3, aerospace: as one of the materials in aerospace and other high-demand fields, it can be used to manufacture aero-engine components, rocket combustion chamber linings and so on. These materials perform well in high-temperature and high-pressure environments and can improve the efficiency and reliability of aircraft and engines.
4, additive manufacturing: ToffeeX's company used self-developed software to design a CPU liquid-cooled heat exchanger, and used electrochemical 3D printing technology to manufacture, so that the pressure drop of the radiator is reduced by 60%. The process is particularly suitable for printing pure copper, thus becoming a promising additive manufacturing process for small, fine cooling plates, heat exchangers, RF antennas and similar devices.
5, catalyst: pure copper powder as a catalyst can improve the rate of chemical reaction, improve the selectivity and control the directionality of the reaction, is widely used in chemical, pharmaceutical, plastics, pigments and other industries.
6, conductive materials: spherical copper powder can be used in the manufacture of contact materials, semiconductor encapsulation materials and stainless steel filling materials. It can be widely used in electronic and electrical appliances, construction, aviation, chemical industry, printing, military and other fields.
7, electromagnetic shielding materials: the high conductivity and energy storage properties of pure copper powder makes it an important raw material for the preparation of electromagnetic shielding materials, in the surface of electronic products coated with a layer of conductive paint can prevent electromagnetic leakage, against external electromagnetic interference.
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