AgCu28 is a eutectic alloy brazing metal with a melting point of 779°C and good electrical conductivity, thermal conductivity, fluidity and wettability. It not only has excellent process performance (suitable melting point, good wettability, strong caulking ability, etc.), but also has strong thermal shock resistance, high welding quality, high sealing strength, and can form a high-strength, high-conductivity and corrosion-resistant brazing joint, which can weld different kinds of metals and alloys, metals and metallized ceramics. The hardness of silver-copper alloy is higher than that of pure silver, its electrical and thermal conductivity is better than that of other alloys, and the price is lower than that of pure silver, which is widely used in electronic component manufacturing, surface coating, electrical engineering, welding materials, thermal management and other fields.
AgCu28 powder is suitable for brazing, additive manufacturing, laser cladding and other application processes, with the characteristics of controllable particle size, low oxygen content, low impurity content, and batch stability.
1. Material standards
The composition meets the requirements of GB/T 18762-2017 specification for precious metals and their alloys.
2. The particle size is controllable
According to different application processes, it can be supplied in batches: -500 mesh, -300 mesh, -200 mesh, 15-53 μm, 45-105 μm, 75-150 μm and other particle size powders, and can also be customized according to customer requirements.
3. Low oxygen content
The core oxygen content control technology can control the oxygen content of the powder according to the specific application technical requirements, and the minimum can be controlled below 200ppm.
4. Low impurity content
The overall impurity content of the powder can be controlled below 0.01% (except for gas content), and the purity ≥ 4N9.
5. Microscopic morphology
The predominantly spherical topography of the powder helps to ensure that the powder has good dispersion and flowability.
6. Liquidity
For 15-53μm powder for additive manufacturing, the Hall fluidity ≤ 15s/50g.
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